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The Lab
As part of
the Materials Science and Engineering
Program, the Electronic Materials
Lab is involved in a wide range of interdisciplinary
research. A few of the specific subject
areas include Cu interconnect failure mechanisms
(including electromigration and
thermal/mechanical), barrier stability, low-k
integration, interconnect resistivity, Pb-free
solder alloy design and evaluation (mechanical and
microstructural), functional
nanocomposites (quantum dots), and flexible thin film
solar cells. Students researchers from
the EML are supported by the excellent facilities of
the UTA NanoFab and MSE
Materials Characterization Center.
   
Explore the web
site to learn more about activities at the Electronic Materials Lab.
Material Science and
Engineering Department
College of Engineering and
College of Science
University of Texas at Arlington
325 Woolf Hall, Box 19031
Arlington TX 76019
817.272.2398
© 2005 The University of Texas at Arlington
Questions concerning this site? Please email:
tcf4506@exchange.uta.edu
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