E-Mail: vishalnagaraj@uta.edu
Publications:
1. “Bump Electromigration and Back End Design Rules”, ECTC 2007, Reno, Nevada (Abstract Submitted).
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Vishal Nagaraj received his
Bachelor's degree in Mechanical Engineering from Visvesvaraya Technological
University, Bangalore, India. He joined Professor Dereje Agonafer's Electronics, MEMS
and Nanoelectronics Systems Packaging Center
Research Team in Fall 2006. His research interests are Thermo- Mechanical
Design and Electronic packaging. He is currently working on PRO-E and ANSYS
workbench analysis of Bump Electromigration. E-Mail: vishalnagaraj@uta.edu Publications: 1. “Bump Electromigration and Back End Design Rules”, ECTC 2007, Reno, Nevada (Abstract Submitted).
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