PUBLICATIONS: (Last 5 years): 

1.           Trivedi, A., D. Sivanandan, D. Agonafer, M. Hendrix, and A. Sahrapour, “Compact Modeling of a Telecommunication Cabinet”, International Mechanical Engineering Congress and Exposition, October 31-November 6, 2008, Orlando, FL.

2.           Mulay V., Agonafer D. and Schmidt R., “Liquid Cooling for Thermal Management of Data Centers”, International Mechanical Engineering Congress and Exposition, October 31-November 6, 2008, Orlando, FL.

3.           A. Fasoro, M. Mittal, D. O. Popa, D.A. Agonafer, and H. E. Stephanou “Design for Reliability Applied to Packaging of a MOEMS Switch,” to appear in ASME Journal of Electronic Packaging, September 2008 (accepted for publication).

4.           Mohammad M Hossain, Fahad Zahedi, Nikhil Lakhkar, Puligandla Viswanadham, Steven O. Dunford and Dereje Agonafer “Reliability of Tin-Silver-Copper Lead-Free Solder Interconnects Under Mechanical Loading with Different PWB Surface Finishes”, SMTA 2008, August 17 - 21, 2008, Orlando, FL

5.           Lakhakar, N., Hossain, M and Agonafer, D., “Rapid Thermo-cycling using Thermoelectric Device: Part I - Hot spot cooling.”, ITherm 2008, May 28 - 31, 2008 in Orlando, Florida.

6.           Uthaman, R., Kaisare, A., Haji-Sheikh, A., Agonafer, D., Mahajan, R. and Chrysler, G., “Multi-objective Optimization Entailing Computer Architecture and Thermal Design for Non-uniformly Powered Microprocessors.”, ITherm 2008, May 28 - 31, 2008 in Orlando, Florida.

7.          Karajgikar S., Nagaraj V., Agonafer D. and Pekin S., “Flip Chip Back End Design Parameters to Reduce Bump Electromigration,” 58th Electronic Component and Technology Conference, Florida, May 27-30, 2008.

8.           Udakeri R., Mulay V., Agonafer D. and Schmidt R., “Comparison of Overhead Supply and Underfloor Supply with Rear Door Heat Exchanger in High Density Data Center Clusters”, Semi-Therm 2008, San Jose, CA, 2008.

9.            Agonafer, Dereje, Kaisare, Abhijit, Hossain, Mohammad M., Lee, Yongje, Dewan-Sandur, Bhavani P., Dishongh, Terry and Pekin, Senol (2008) 'Thermo-Mechanical challenges in stacked packaging', Heat Transfer Engineering,29:2, 134 - 148

10.        Kaisare, A.; Agonafer, D.; Haji-Sheikh, A.; Chrysler, G.; Mahajan, R., “Development of an analytical model to a temperature distribution of first level package with a non-uniformly powered die,” to be published in the  Journal of Electronic Packaging

11.       Raju, U; Kaisare, A.; Agonafer, D.; Haji-sheikh, A.; Chrysler, G. ; Mahajan, R. , “Multi-Objective optimization entailing computer architecture and thermal design for non-uniformly powered microprocessors ,”  Thermal and Thermomechanical  Phenomena in Electronic Systems, 2008, ITHERM 2008

12.      Agonafer D., Kaisare A., Mulay V., Karajgikar S. and Lakhkar N., “Thermomechanical Challenges in Electronic Packaging”, Semi-Therm 2008, San Jose, CA, 2008.

13.      Arijit Banerjee, Nikhil Lakhkar, Shahi Riaz, Dereje Agonafer and Gamal Refai-Ahmed, “Multi-Objective parametization of graphite heat spreaders for portable systems applications”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

14.      Kaisare, A.; Agonafer, D.; Haji-Sheikh, A.; Chrysler, G. INTEL; Mahajan, R. INTEL, “Analytical Approach To Temperature Distribution Of A First Level Package With A Non-Uniformly Powered Die,” International Mechanical Engineering Congress and Exposition, November11-15, 2007.

15.      Nagaraj V., Karajgikar S., Agonafer D. and Pekin S., “Bump Electromigration and Back End Design Rules”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

16.       Mulay V., Karajgikar S., Agonafer D., Iyengar M. and Schmidt R., “Parametric Study of Hybrid Cooling Solution for Thermal Management of Data Centers”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

17.       Uthaman R., Agonafer D., “Static Power Consumption – Silicon On Insulator Metal Oxide Semiconductor Field Effect Transistor”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

18.      Trivedi, A.; Tadepalli, C.; Kaisare, A.; Agonafer D.; Refai-Ahmed, G. AMD, “Effect of weight of Heat Sink Assembly on Mechanical Reliability of a Wire Bonded  Plastic Ball Grid Array package,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

19.      Kaisare, A.; Agonafer, D.; Haji-sheikh, A.; Chrysler, G. INTEL; Mahajan, R. INTEL, “Numerical model for design of non uniform powered microprocessors using multi-objective optimization based on both thermal and device clock performance ,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

20.       Mulay, V.; Karajgikar, S.; Iyengar, M.IBM; Agonafer, D.; Schmidt, R.IBM,“ Computational study of hybrid cooling solution for thermal management of data centers, ” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

21.      Lakhkar, N.; Fasoro, A.; Patil, A.; Lee, W.H.; Popa, D.; Stephanou, H.; Agonafer, D., “Process development and die shear testing in MOEMS packaging,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

22.      Trivedi, A.; Lakhkar, N.; Agonafer, D.; Iyengar, M. IBM; Ellsworth, M Jr. IBM; Schmidt, R. IBM ,“Experimental and Computational Characterization of a Heat sink Tester,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

23.       Lakhkar, N.; Hossain, M.; Puligandla V.; Agonafer, D., “Mechanical characterization of lead SAC lead free solder with gold addition under tensile loading,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

24.      Fasoro, A.; Pandojirao, P.; Lee, W.H.; Popa, D.; Stephanou, H.; Agonafer, D., “die and wafer-level hermetic for MEMS applications,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

25.      Paruchuri, Srikar, Sin, Jeongsik, Graff, Mason and Agonafer, D., “Flexible PDMS Chip with Embedded In-plane Valves for Microfluidic Manipulations,” 5th International Conference on Nanochannels, Microchannels and Minichannels, June 18-20, 2007, Puebla, Mexico.

26.      Hossain, M.M., Sudhakar Jagarkal, Dereje Agonafer, Menberu Lulu, and Stefan Reh, “Design Optimization and Reliability of PWB Level Electronic Package”, Journal of Electronic Packaging, March 2007,Volume 129, Issue 1, pp. 9-18 .

27.       Siddharth Bhopte, Dereje Agonafer, Roger Schmidt, and Bahgat Sammakia, “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature,” Journal of Electronic Packaging, Transactions of the ASME, v 128, Issue 4, December 2006, pp. 380-387

28.       Kaisare, Abhijit, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, and Ravi Mahajan, “Approximate Analytical Model for a First Level Package with Non-Uniformly Powered Die,” International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

29.       Hossain, Mohammad, Dereje Agonafer, Viswanadham Puligandla, and Tommi Reinikainen, “Deformation Characteristics and Constitutive Relationship of SnAgCu Lead Free Solder Alloys under Thermo-mechanical and Mechanical Loading.” International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

30.       Sung, Baekyoung, Chepuri Krishna Teja, Venkata, Yongje Lee, Dereje Agonafer, Damena Agonafer, and Cristina Amon, “Thermal Enhancement of Stacked Dies Using Thermal Vias.” International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

31.       Bhopte, Siddharth, Madhusudan K. Iyengar, Bahgat Sammakia, Roger Schmidt and Dereje Agonafer, “Numerical Modeling of Data Center Clusters – Impact of Model Complexity”, International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

32.       Bhopte, Siddharth, Madhusudan Iyengar, Bahgat Sammakia, Roger Schmidt and Dereje Agonafer, “Effect of Under Floor Parameters on Data Center Performance”, Honorary Symposium for Dr. Suhas V. Patankar, International Mechanical Engineering Congress and Exposition 2006, November 5-10, 2006, Chicago Hilton.

33.       Kaisare, A., Dereje Agonafer, A. Haji-Sheikh, Ravi Mahajan and Greg Chrysler, “Analytical approach to temperature distribution of a first level package with a non-uniformly powered processor”, ITHERM May 30-June 2, 2006, Sheraton San Diego Hotel and Marina.

34.       Bhopte, Siddharth, Bahgat Sammakia, Madhusudan Iyengar, Roger Schmidt and Dereje Agonafer, “Effect of Under-Floor Blockages on Data Center Performance”, ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

35.       Sandur, Bhavani P.D., Abhijit Kaisare, Dereje Agonafer, University of Texas-Arlington, USA, Damena Agonafer, Cristina Amon, Carnegie Mellon University; and Terry Dishongh, Intel Corporation, “Thermal Management of Stacked Die that Includes Memory and Logic Processors”, ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

36.       Hossain, Mohammad M. Fahad Zahedi, Dereje Agonafer, Viswam Puligandla, Tommi Reinikainen, Steven Dunford, “Reliability of lead free SAC solder interconnects under mechanical loading with different PWB surface finishes”, ITHERM May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA

37.       Hossain, M.M., Y.C. Lee, Roksana Akhter, Dereje Agonafer, Senol Pekin, and Terry Dishongh, “Solder Joint Fatigue Life Predictions varying the Die Stacking Architectures for Flash Memory Applications”, ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA

38.       Abiodun A. Fasoro, Dan O. Popa, Heather Beardsley, Jeongsik Sin, Dereje Agonafer, Harry E. Stephanou and Michael A. Deeds, “Fluxless Optical Fiber Attachment for Hermetic MOEMS Applications,” ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

39.       Bedekar, Vishwas, Saket Karajgikar, Dereje Agonafer, Madhusudan Iyengar and Roger Schmidt, “Effect of Crac Location on Fixed Rack Layout,” ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

40.       Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, Dereje Agonafer and Harry Stephanou, “Design of Polymer Tube Embedded In-Plane Micropump,” May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

41.       Borovic, Bruno, Frank L. Lewis, Hossain, M.M., and Dereje Agonafer, “Robust Multiphysics FEA Methodology for Extracting a Reduced-Order Model of MEMS Thermal Actuators”, published in ECTC, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

42.       Hossain, M.M., Y. Lee, Roksana Akhter, Dereje Agonafer, Senol Pekin, and Terry Dishongh, “Reliability of Stack Packaging Varying the Die Stacking Architectures for Flash Memory Applications”, Semi-Therm, March 12-16, 2006, Dallas TX.

43.       Kaisare, Abhijit, Dereje Agonafer, A Haji-Shiekh, Ravi Mahajan and Greg Chrysler, “Design Rule For Minimizing Thermal Resistance In A Non–uniformly Powered Microprocessor”, Semi-Therm, March 12-16, 2006, Dallas TX.

44.       Borovic, Bruno, Frank L. Lewis, Dereje Agonafer, Edward S. Kolesar, Mohammad M. Hossain, Dan O. Popa, “Method for Determining a Dynamical State Space Model for Control of Thermal MEMS Devices,” Journal of Microelectromechanical Systems, Vol. 14, Issue 5, October 2005, p 961-970.

45.       Lakhkar, Nikhil R., Madhusudan Iyengar, Michael Ellsworth Jr., and Dereje Agonafer, “Design of a cold plate tester for accurate measurement of thermal performance,” Proceedings of International Mechanical Engineering Congress and Exposition-05 Orlando FL, November 5-11, 2005.

46.       Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, Dereje Agonafer and Harry Stephanou. “Polymer tube embedded in-plane micropump: design, analysis and fabrication.” Proceedings of International Mechanical Engineering Congress and Exposition-05 Orlando FL, November 5-11, 2005.

47.       Akhter, Roksana, Bhavani P.D. Sandur, Mohammad Hossain, Abhijit Kaisare, Dereje Agonafer, Kent Lawrence and Terry Dishongh, “Design for Stackability of Flash Memory Devices Based on Thermal Optimization”, Proceedings of 24^th Digital Avionics Systems Conference, Washington, D.C., October 30 – November 3, 2005

48.       Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, and Dereje Agonafer, “Polymer Tube Embedded In-Plane Micropump for Low Flow Rate”, Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, and Dereje Agonafer. Proceedings of 24^th Digital Avionics Systems Conference, Washington, D.C., October 30 – November 3, 2005.

49.       Refai-Ahmed, Gamal and Dereje Agonafer, “Thermal Road map for Telecom Equipment,” ASHRAE Transactions, v 111 n 1, 2005, p 913-920

50.       Bhopte, Siddharth, Dereje Agonafer, Roger Schmidt, Bahgat Sammakia, “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature,”. InterPACK’05 Conference, San Francisco, CA, July 17-22, 2005.

51.       Karajgikar, Saket, Wonkee Ahn, and Dereje Agonafer, “Effect of Continuous and Discontinuous Fabrication and Reflow Process on PWB Warpage,” InterPACK’05 Conference, San Francisco, CA, July 17-22, 2005.

52.        Kaisare, Abhijit, Agonafer, Dereje, Haji-Sheikh, A., Chrysler, Greg, and Mahajan, Ravi, “Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die,” InterPACK’05, San Francisco, CA, July 17-22, 2005.

53.       Hossain, Mohammad, Agonafer, Dereje, Puligandla, Viswanadham, and Reinikainen, Tommi, “Lead-Free and Sn/Pb Solders Alloy Behavior under Cyclic Bending,” InterPACK’05, San Francisco, CA, July 17-22, 2005.

54.       Karajgikar, Saket; Lakhkar, Nikhil; Agonafer, Dereje; Schmidt, Roger, “Impact of area contact between sensor bulb and evaporator return line on modular refrigeration unit: Computational and experimental”, Journal of Heat Transfer,  v 127, n 1, January, 2005, p 95-100

55.       Mulay, Veerendra; Kulkarni, Amit; Agonafer, Dereje; Schmidt, Roger, “Effect of the location and the properties of thermostatic expansion valve sensor bulb on the stability of a refrigeration system”, Journal of Heat Transfer, v 127, n 1, January, 2005, p 85-94

56.       Amon, Cristina; Agonafer, Dereje, “Foreword: Special issue on electronic cooling”, Journal of Heat Transfer, v 127, n 1, January, 2005, p 1

57.       Bhopte, Siddharth; Alshuqairi, Musa S.; Agonafer, Dereje; Refai-Ahmed, Gamal, “Mixed convection of impinging air cooling over heat sink in telecom system application”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4, December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 519-523

58.       Ahn, Wonkee; Agonafer, Dereje; Novotny, Shlomo, “Methodology for an integrated (electrical/mechanical) design of PWBA”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4, December, 2004,  Thermal Management of Electronic Systems: Four Decades of Progress, p 524-527

59.       Wang, P., Huang, G., Ching, H., Hsu, H., Novotny, S., Ahn, W., and Agonafer, D., “µPGA Socket and Solder Joint Reliability Study”, 2004, Proc. of Pan Pacific Electronic Conference and SMTA, 3, Kauai, Hawaii, pp. 67–84.

60.       Makwana, Yasin; Agonafer, Dereje; Manole, Dan, “Impact of TXV and compressor in the stability of a high-end computer refrigeration system”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4, December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 554-559

61.       Sammakia, Bahgat; Agonafer, Dereje, “Journal of Electronic Packaging, Transactions of the ASME: Foreword”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4,December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 409

62.       Agonafer, Damena; Ibarra, Juan; McGee, Kendrick; Platt, Frank; Harris, Kendall; Agonafer, Dereje, “Heat pipe optimization team the heat pipe assisted heat sink project”, Innovations in Engineering Education 2004: Mechanical Engineering Education, Mechanical Engineering Technology Department Heads,  Innovations in Engineering Education 2004:Mechanical Engineering Education, Mechanical Engineering Technology Department Heads, 2004, p 363-372

63.       Kuravi, Suma; Agonafer, Dereje, “Validation of ASHRAE equation to find evaporation rates in humid cavity”, American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 375, n 2, Proceedings of the ASME Heat Transfer Division - 2004, 2004, p 109-116

64.       Xu, Leon (NOKIA Inc., MS 3-4-1400); Reinikainen, Tommi; Ren, Wei; Wang, Bo Ping; Han, Zhenxue; Agonafer, Dereje, “A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending”, Microelectronics Reliability, v 44, n 12, December, 2004, p 1977-1983

65.       Hossain, Mohammad M; Agonafer, Dereje; Viswanadham, Puligandla; Reinikainen, Tommi, “Strain based approach for predicting the solder joint fatigue life with the addition of intermetallic compound using finite element modeling”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 358-367

66.       Jagarkal, Sudhakar G.; Hossain, Mohammad Masum; Agonafer, Dereje; Lulu, Menberu; Reh, Stefan, “Design optimization and reliability of PWB level electronic package”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 368-376

67.       Borovic, Bruno; Lewis, Frank L.; Hossain, Mohammad M.; Agonafer, Dereje; Kolesar, Edward S., “Experimentally verified procedure for determining dynamical model of the ETM MEMS structures”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 541-548

68.       Halvi, Ananth Srivatsav; Ahn, Wonkee; Agonafer, Dereje; Novotny, Shlomo, “Simulation of PWB warpage during fabrication and due to reflow”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 674-678

69.       Karajgikar, Saket; Lakhkar, Nikhil; Agonafer, Dereje; Schmidt, Roger, “Impact of area contact between sensor bulb and evaporator return line on MRU - Part II, experimental work”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 1, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 232-236

70.       Haji-Sheikh, A.; Beck, J.V.; Agonafer, D., “Steady-state heat conduction in multi-layer bodies”, International Journal of Heat and Mass Transfer, v 46, n 13, June, 2003, p 2363-2379

71.       Makwana, Yasin; Agonafer, Dereje; Manole, Dan, “Performance of a Masterflux Compressor in a Refrigeration Unit For High End Computer System Application”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 533-538

72.       Lakhkar, Nikhil; Karajgikar, Saket; Agonafer, Dereje; Schmidt, Roger, “The impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit - Part I, Computational Study”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 651-656

73.       Novotny, Shlomo; Ahn, Wonkee; Agonafer, Dereje, “A Methodology for an Integrated (Electrical/Mechanical) Design of PWBA”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 721-727

74.       Alshuqairi, Musa S; Refai-Ahmed, Gamal; Agonafer, Dereje, “Mixed Convection of Impinging Air Cooling over Heat Sink in Telecom System Application”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 777-783

75.       Hossain, Mohammad Masum; Agonafer, Dereje; Viswanadham, Puligandla; Reinikainen, Tommi, “The effect of intermetallic compound in solder joint fatigue life prediction using finite element modeling”, Advances in Electronic Packaging, v 1,  Advances in Electronic Packaging 2003: Volume 1, 2003, p 853-862

76.       Ahn, Wonkee; Agonafer, Dereje; Novotny, Shlomo, Advances in Electronic Packaging, “The Impact of Board Layout and Layup on PWB Warpage during fabrication and due to Reflow Solder Process: A Review of Literature”, v 1, Advances in Electronic Packaging 2003: Volume 1, 2003, p 863-877

77.       Guggari, Shrishail; Agonafer, Dereje; Beady, Christian; Stahl, Lennart, “A hybrid methodology for the optimization of data center room layout”, Advances in Electronic Packaging, v 2, Advances in Electronic Packaging 2003: Volume 2, 2003, p 605-612

78.       Kulkarni, Amit; Agonafer, Dereje; Schmidt, Roger, “Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part II”, Advances in Electronic Packaging, v 2,  Advances in Electronic Packaging 2003: Volume 2, 2003, p 613-619

79.       Kulkarni, Amit; Agonafer, Dereje; Groothuis, Steven; Kabir, Humayun; Johnson, S., “Package and board level study for a thin small outline package (TSOP) using compact components”, Advances in Electronic Packaging, v 2, Advances in Electronic Packaging 2003: Volume 2, 2003, p 867-873

80.       Mulay, Veerendra; Agonafer, Dereje; Schmidt, Roger, “Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system”, American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 374, n 2, Proceedings of the ASME Heat Transfer Division - 2003 Volume 2: Gas Turbine Heat Transfer, Heat Transfer in Electronic Equipment, Heat Transfer in Energy Systems, Low-Temperature Heat Transfer, 2003, p 299-305

81.       Nnanna, A.G. Agwu; Haji-Sheikh, A.; Agonafer, D., “Effect of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces”, Journal of Electronic Packaging, Transactions of the ASME, v 125, n 3, September, 2003, p 456-460